Data sheet Product ICK PGA 16 x 16 x 8

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
40 x 40 x 8 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
40 mm
height:
8 mm
plate thickness:
3.5 mm
length:
40 mm
thermal resistance:
14 - 3.2 K/W
dissipation loss:
4.9 W
surface:
black anodised

Technical Drawing