Liquid heatsink for power modules with internal lamella structure

Liquid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6,5-8,5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others;dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8"" or mounting flange according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 17 mm

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids.

Water-gycol mixture (60/40); inlet temperature approx. 26 °C
dimensions and designs using customer's instructions;
Material: EN AW 6060 (Al Mg Si 0,5)

Liquid heatsink for power modules with internal lamella structure

Liquid cooler for dissipating large quantities of heat with low space requirement; effective system to cool power modules; suitable for water pH 6,5-8,5 with anticorrosive, as well as other fluids (eg. oil, alcohols, etc.); compact design with internal fin structure for particularly good heat transfer to the fluid; minimised flow pressure losses; operating pressure up to 2 bar possible; thick base plate for optimum heat distribution and to secure the heat-emitting elements; mounting flange for the cooler according to customer's instructions; precisely face milled surface of component mounting area with very good eveness and low roughness depth; for power modules like IGBT-module, Thyristor-module, SCR diode module, bridge amplifiers and others;dimensionally accurate adjustment to given mounting conditions; conncetions with thread muffle 1/8"" or mounting flange according to customer's instructions; I- or U-throughflow or multiple throughflow versions; max. drilling depth in the base plate: 17 mm

To avoid corrosion in the water cooler the cooling fluid has to flow in a closed circuit and it has to contain 40-60% (preferred is 50%) anti-corrosive fluids for aluminium, if necessary with anti-freeze. For the choice and approval of the cooling fluid as well as for the possible consequences in the cooling circuit the user is the only liable person. Therefore we exclude any liability for damages caused by the choice or approval of the cooling fluids.

Water-gycol mixture (60/40); inlet temperature approx. 26 °C
dimensions and designs using customer's instructions;
Material: EN AW 6060 (Al Mg Si 0,5)