Heatsinks for BGAs |
Heatsinks for BGAs
ICK BGA 10 x 10
- particularly suited for Ball Grid Arrays
- heatsink dimensions match the respective BGA-type
- can be glued directly on the BGA component
- double-sided adhesive thermal conductive foil WLF ...
- surface: black anodised
way of fixation: |
|
socket: | universal
|
suitable for processor type: | universal
|
width: | 10 mm
|
height: | 6 mm
|
plate thickness: | 1.8 mm
|
length: | 10 mm
|
thermal resistance: | 32 - 10 K/W
|
dissipation loss: | 1.8 W
|
surface: | black anodised
|
FRI 7:30 - 15:15