Data sheet Product EMB 175 150 SA KL BL
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Cases>Heat dissipating case
Embedded case
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
* accessories mounting set BFS
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
- universal cooling fin case made of aluminium extruded profile, cover panels in 2 mm thickness and removable bottom panel
- optimized heat dissipation by means of external cooling fins
- the integrated T-grooves in the case profile for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means
- internal guide grooves for inserting PCBs or mounting plates
- wall-, ceiling- or top-hat rail mounting by means of fixing straps or top-hat rail mounting from the bottom
- special designs, embedded cover panels, machinings, surfaces and printings upon request
* accessories mounting set BFS
Features
surface: | black anodised
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way of fixation (optional): | fixing of mounting rail
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