Data sheet Product EMB 175 150 SA KL BL

emb_.tif
Cases>Heat dissipating case
Embedded case
contents of delivery: 1 = 1 x case profile; 2 = 2 x cover panel; 3 = 1 x bottom panel; 4 = mounting material
 
  • universal cooling fin case made of aluminium extruded profile, cover panels in 2 mm thickness and removable bottom panel
  • optimized heat dissipation by means of external cooling fins
  • the integrated T-grooves in the case profile for mounting of i.e. mainboards in the Mini-ITX or NUC form factor by means of distance, bolts and mounting plate also EBX, Nano ITX, EPIC, ETX/XTX and PC/104 form factors by means
  • internal guide grooves for inserting PCBs or mounting plates
  • wall-, ceiling- or top-hat rail mounting by means of fixing straps or top-hat rail mounting from the bottom
  • special designs, embedded cover panels, machinings, surfaces and printings upon request

* accessories mounting set BFS

Features

surface:
black anodised
way of fixation (optional):
fixing of mounting rail

Technical Drawing

length:
150 mm / 200 mm / 250 mm

Further Information