Data sheet Product FK 256

fk256.tif
Board Level heatsinks>Copper heatsinks for D PAK and others
  • direct PCB mounting due to solderable surface
  • standard packing: loose parts (bulk goods) oder gegurtet (TR = Gurt und Spule)
  • Gurtbreite: 24 mm, Spulendurchmesser: 330 mm, Stückzahl: 200

Features

for transistor:
  • SOT 223
  • Power SO 8
  • D3 PAK (TO 268)
  • Power_SO_20
  • SO-14
  • D2 PAK (TO 263)
  • Power SO 10
  • D PAK (TO 252)
  • SOT 669 LF PAK
  • SO-16
  • SO IC 8 FL MP
  • SO-8
  • Power SO 36
width:
25.4 mm
height:
11.43 mm
length:
19.38 mm
thermal resistance:
11 K/W
surface:
solderable surface
material:
copper (Cu)
material thickness:
0.6 mm

Technical Drawing

fk256.eps