Data sheet Product ICK BGA 21 x 21

ickbga21x21.jpg
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
21 x 21 x 6 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
21 mm
height:
6 mm
plate thickness:
1.8 mm
length:
21 mm
thermal resistance:
24.3 - 8 K/W
dissipation loss:
2.5 W
surface:
black anodised

Technical Drawing

ick_bga21x21.eps