Data sheet Product ICK BGA 31 x 31 x 10

ickbga31x31x10.jpg
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
31 x 31 x 10 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
31 mm
height:
10 mm
plate thickness:
1.8 mm
length:
31 mm
thermal resistance:
17 - 5 K/W
dissipation loss:
3.7 W
surface:
black anodised

Technical Drawing