Data sheet Product ICK BGA 33 x 33 x 6
Heatsinks and active heatsinks for processors>Heatsinks for BGAs
33 x 33 x 6 mm, for IC design BGA and others
Features
way of fixation: |
|
socket: | universal
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suitable for processor type: | universal
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width: | 33 mm
|
height: | 6 mm
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plate thickness: | 1.8 mm
|
length: | 33 mm
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thermal resistance: | 17.5 - 6.8 K/W
|
dissipation loss: | 3.4 W
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surface: | black anodised
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