Data sheet Product ICK BGA 33 x 33 x 6

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Heatsinks and active heatsinks for processors>Heatsinks for BGAs
33 x 33 x 6 mm, for IC design BGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
33 mm
height:
6 mm
plate thickness:
1.8 mm
length:
33 mm
thermal resistance:
17.5 - 6.8 K/W
dissipation loss:
3.4 W
surface:
black anodised

Technical Drawing