Data sheet Product ICK PGA 15 x 15

ick_pga.tif
Heatsinks and active heatsinks for processors>Heatsinks for PGA
38,1 x 37,92 x 16,5 mm, for IC design PGA and others

Features

way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
38.1 mm
height:
16.51 mm
plate thickness:
3.5 mm
length:
37.92 mm
thermal resistance:
9.4 - 2.1 K/W
dissipation loss:
5.9 W
surface:
black anodised

Technical Drawing

ick_pga15x15.eps