The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
Service hotline
MON-THR 7:30 - 15:45
FRI 7:30 - 15:15
E-mail service

Heatsinks for BGAs

ickbga29x29x14.jpg
ick_bga29x29x14.eps

Heatsinks for BGAs

ICK BGA 29 x 29 x 14

29 x 29 x 14 mm, for IC design BGA and others
Price on application
Quantity
Features
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
29 mm
height:
14 mm
plate thickness:
1.8 mm
length:
29 mm
thermal resistance:
17 - 5 K/W
dissipation loss:
3.5 W
surface:
black anodised
Technical Drawing
Accessories / similar products
WLF:
wlft404_405_2.tif
isolations, double sided adhesive
 
wlft404_405_2.tif
non isolations, double-sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

Cookies