The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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1 - 12 (39)Number:
sk701.jpg
15 x 25 mm, for THFU 1-3+6+7, profile-pressed threads
sk703.jpg
15 x 45 mm, for THFU 1-4+6, profile-pressed threads
sk702.jpg
20 x 50 mm, for THFU 1-4+6, profile-pressed threads
sk697.jpg
35 x 30 mm, for THFU 1-6, profile threads
sk704.jpg
33 x 53 mm, for THFU 1-4+6, profile-pressed threads
sk705.jpg
39 x 32 mm, for THFU 1-4+6, profile-pressed threads
la_hb4.jpg
66 x 66 mm, with axial fan,
high performance cooling aggregate
  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_hb5.jpg
129 x 66 mm, with axial fan,
high performance cooling aggregate
  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_hb6.jpg
190 x 66 mm, with axial fan,
high performance cooling aggregate

  • compact construction by means of connected extruded profiles
  • excellent efficiency by means of flow-optimised hollow fin structure
  • powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb4.jpg
66 x 66 mm, with axial fan and air-flow chamber,
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb5.jpg
129 x 66 mm, with axial fan and air-flow chamber,
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
la_v_hb6.jpg
190 x 66 mm, with axial fan and air-flow chamber
high performance cooling aggregate
  • additional efficiency enhancement and noise reduction by means of air-technically adjusted airflow chambers
  • excellent thermal efficiency in connection with powerful axial fans
  • double-sided precise milled semiconductor mounting surfaces
  • different width dimensions, customised machinings, surfaces, fan types and fan voltages upon request
1 - 12 (39)Number:

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