The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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Heatsinks for BGAs

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Heatsinks for BGAs

ICK BGA 21 x 21

21 x 21 x 6 mm, for IC design BGA and others
Price on application
Quantity
Features
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
21 mm
height:
6 mm
plate thickness:
1.8 mm
length:
21 mm
thermal resistance:
24.3 - 8 K/W
dissipation loss:
2.5 W
surface:
black anodised
Technical Drawing
Accessories / similar products
Product family accessory of product family:
11 - 13 (13)Number:
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  • space networking thermal conductive glue made on silicone basis
  • very good thermal conductivity
  • mixing in ration 1:1 with static mixing tube
  • hardening will be proceeded at room temperature
  • wide range of temperatures
  • store cool, dark and dry
 
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  • one-sided adhesive thermal conductive foil
  • additional fiberglass reinforcement
  • high long-term and mechanical stability
  • easy handling and mounting
  • cuts and contours according to customer-specific drawing specifications
 
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silicone-free thermal transfer compound
 
11 - 13 (13)Number:
WLF:
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isolations, double sided adhesive
 
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non isolations, double-sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

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