The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
Service hotline
+49 2351 435-0
MON-THR 7:30 - 15:45
FRI 7:30 - 15:15
E-mail service
info@‍‍fischerelektronik.de

Thermal conductive paste and thermal interface film

Phase Change thermal interface material

fsf52p.tif
fsf52p_.jpg

Thermal conductive paste and thermal interface film

FSF 20 P
FSF 30 P

FSF 30 P

Phase Change thermal interface material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
  • density: 
    2.4 g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of: 
    0.1 K/W
    0.031 N/mm2
  • temperature range: 
    ≤+150°C
  • adhesive holding force: 
    0.6 N/mm2
  • dielectric constant: 
    5.2 [1 kHz] / 4.8 [1 MHz]
  • class of inflammability: 
    UL 94 V-0
Price on application
Quantity
Comparison list
Data sheet
Features
material thickness:
0.12±0,025 mm
colour:
grey
density:
2.4 g/cm3
phase change temperature:
50 °C
thermal conductivity:
3 W/m·K
thermal resistance (1 in2, TO 3) at contact pressure of:
0.1 K/W
0.031 N/mm2
temperature range:
≤+150°C
adhesive holding force:
0.6 N/mm2
dielectric constant:
5.2 [1 kHz] / 4.8 [1 MHz]
class of inflammability:
UL 94 V-0
type of delivery:
  • plates, usable area 400x300mm
  • other dimensions upon request
storage conditions:
  • +1 °C - +30 °C
  • cool and dark
shelf life:
6 months
Variants
fsf52p_.jpg
  • density: 2.9 g/cm3
  • thermal resistance (1 in2, TO 3) at contact pressure of: 0.08 K/W
    0.031 N/mm2
  • temperature range: ≤+150°C
  • adhesive holding force: 0.6 N/mm2
Phase Change thermal interface material
  • strapless (free standing film) changing condition thermal conductive material as a foil
  • material with phase changing temperature at 48 °C or 52 °C
  • best thermal conductivity, above the phase change temperature the material flows in all gaps of the impinged device and heatsink
  • thixotropic, therefore no migration of the material away from the moistened surface
  • no influence on the thermal conductivity due to thermal cycles
  • only low contact pressure necessary, as it is no elastomer and therefore ideally suitable for clamp mounting of the devices
  • not electrically conductive, but no insulator
  • self-adhesive properties, also suitable for large surfaces
  • no toxic ingredients
  • customised cuts upon request
  • with double-sided protective film
 
* This information refers to the standard variant of the product, so it might change when another variant is chosen.
Service
Technical explanations
Overview thermal interface material incl. position conditions
Data sheet
Data sheet

Cookies